| Features | |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.0 |
| Backlight | No |
| Buffered memory type | Unregistered (unbuffered) |
| CAS latency | 36 |
| Component for | PC |
| Cooling type | Heatsink |
| Country of origin | China |
| Country of origin | Taiwan |
| ECC | No |
| Internal memory | 32 GB |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| Lead plating | Gold |
| Memory data transfer rate | 5600 MT/s |
| Memory form factor | 288-pin DIMM |
| Memory layout (modules x size) | 2 x 16 GB |
| Memory ranking | 1 |
| Memory voltage | 1.25 V |
| Module configuration | 2048M x 64 |
| On-Die ECC | Yes |
| Programming power voltage (VPP) | 1.8 V |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| Row cycle time | 48 ns |
| SPD profile | Yes |
| Logistics data | |
| Master (outer) case gross weight | 2.75 kg |
| Master (outer) case height | 101.6 mm |
| Master (outer) case length | 311.1 mm |
| Master (outer) case width | 203.2 mm |
| Products per master (outer) case | 25 pc(s) |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Packaging data | |
| Package depth | 14 mm |
| Package height | 171.4 mm |
| Package weight | 101.72 g |
| Package width | 95.2 mm |
| Weight & dimensions | |
| Depth | 133.3 mm |
| Height | 34.9 mm |
| Weight | 67.48 g |
| Width | 6.62 mm |
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